However, this fundamental principle also comes with an inherent problem. A power module, by design, harnesses the intrinsic ability of semiconductors to be ‘switched’ for power conversion and control.
However, power electronics assemblies are also ostensibly the most critical components in renewables technologies from the point of view of efficiency, performance and cost (H. These sectors have a central role to play in relation to urgent issues surrounding environmental preservation and global sustainability strategies (Chan, 2006).
Power electronics is an important energy conversion technology which strongly underpins progress within several major industrial sectors including transport and energy generation.
DATACON 2200 EVO MANUAL PDF CRACK
A comparison of two sintered attachments with contrasting bulk porosities allows the effect of initial bond quality on crack development to be examined. It is shown that the cracks develop within the sintered attachment layer and eventually cross over into the substrate. Other imaging techniques (metallographic etching and scanning electron microscopy) have been used in correlation with 3D renderings of these cracks to analyse their propagation and reveal their relationship both with the internal structure of the sintered attachment itself, and the structure of the substrate to which it is joined. They demonstrate, for example, that the structure of the sintered attachment densifies under operation, and a consequence of this is the formation of shrinkage cracks in the most porous regions, much like mud‐cracks. These perspectives provide qualitative information which elucidates the degradation mechanisms. Using 3D tomography affords otherwise infeasible perspectives, such as virtual cross‐sections in the lateral plane of the attachment. This same sample‐study is about observing how the fine‐scale structure of a sintered attachment evolves and degrades over time. However, their degradation mechanisms are not as well understood. Sintered nanosilver die‐attachments have been proposed as a more reliable and environmentally friendly alternative to solder alloy joints for emerging power electronics module designs. This paper concerns the use of three‐dimensional (3D) X‐ray tomography, a nondestructive technique, to perform cradle‐to‐grave studies of sintered nanosilver die‐attachments under operation. Finally, cracks within the sintered joint are shown to have a negligible impact on the conduction pathway of the joint due to their aspect ratio and orientation with respect to the assembly. Examination of the texture (differing levels of X‐ray absorption) of virtual cross‐sectional images reveals the origins of the nonuniformity of densification. Evidence is provided of heterogeneous densification within the sintered joint under power cycling, and this is shown to play a major role in driving the initiation and propagation of the cracks. The propagation characteristics of these cracks within the substrate are analysed. Crack fronts which develop in the most porous regions within the sintered attachment layer travel across the boundary into the copper substrate.
Lateral views of crack development are presented, which show networks analogous to mud‐cracks. This enables contextualization of some of the fine‐scale properties which underpin the large‐scale damage observed via tomography. Morphologies were extracted from tomography data and integrated with data from microscopy modalities at different resolution levels. A time‐lapse study of thermomechanical fatigue damage has been undertaken using three‐dimensional X‐ray computer tomography.